QTC11

QTC11

PTC silicon die precision thermistors are used in wire-bonding and specialized reflow-soldering applications.  Board attachment by either wire bonding, conductive epoxy, or a combination of both may be used. Solder attachment may be performed using different solder configurations, however it is not recommended.

Engineering Information

  • Part size: 0.032” by 0.032” square
  • Part thickness: 0.028”, 0.050” or 0.072”
  • Positive temperature coefficient: 0.7%/˚C
  • Operating temperature range: -55˚C to 125˚C
  • Typical Dissipation Constant: 2mW/˚C min. in still air
  • Typical Time Constant: 8 seconds max in still air
  • Tolerances: 1%, 2%, 5%, 10%
  • Power rating: 0.0625 W at 25˚C, derate to 0 W at 125˚C (Table 2)
  • Resistance values from 10 ohms to 10k ohms
  • Available with gold terminations
  • Board attachment by either wire bonding or conductive epoxy
  • RoHS compliant
  • Available waffle packed or tape and reel